Price: | US $ 0.1/Piece |
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Trade Terms: | FOB,CFR,CIF |
Min Order: | 1/Piece |
Pay Type: | L/C,T/T,D/P,Paypal,Money Gram |
Specifications
Prod Model: | pcb-0151 |
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Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
We Found: | in 1998 |
Land Area Of Our Factory: | More Than 10000 Square Meter |
Business Nature: | Manufacturing of Printed Circuit Board |
Layer No.: | 1-16 |
Cooper Thickness: | 0.5 Oz-11oz (18 Um-385 Um) |
Finished Board Thickness: | 0.2 mm-3.8mm'(8 Mil-150 Mil) |
Laminate Materials: | Fr-4,Fr-1,,Fr-2,Cem-1,Cem-3 |
Certificate: | RoHS, ISO9001:2008, SGS, UL Certificate |
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
Material: | Fiberglass Epoxy |
Flame Retardant Properties: | V0 |
Product Description
We are the Printed Circuit Boards(PCB) manufacturer with 15 years experience, specialized in single-sided, 2-layerd, multilayer and high density interconnector (HDI) PCB.Description | Capability |
PCB Surface Finishes | electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver |
PCB Board Max. Size | 1200mm×600mm |
PCB Board Min. Size | 5mm×5 mm |
Bow & Twist Tolerance | Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% |
Min. Board Thickness & Tolerance | 0.2mm±0.08mm |
Min. trace/spacing | Tin board:0.2mm±20%(8mil±0%) |
gold board:0.075mm±20%(3mil±0%) | |
Copper to Board Edge Spacing | 0.5mm(20mil) |
Hole to Trace Spacing | 0.3mm(12mil) |
Min. Hole Diameter | 0.2mm±.076mm(8mil±3mil) |
Min. Hole Clearance | 0.4mm±.076mm(16mil±3mil) |
Copper Thickness on Hole Wall | 20-25um(0.79mil-1.0mil) |
Hole Location Tolerance | ±0.076mm(l±3mil) |
Min Diameter of Punching Hole | FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) |
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) | |
Min. Punching Slot | FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) |
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) | |
Trace width variation | ±0.076mm(±3mil) |
Outline Tolerance | Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) |
V-CUT Registration Tolerance±0.2mm (±8mil) | |
Type | Single-sided, double-sided, multi-layer |
Major Material | FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base |
Thickness | 0.2-3.5mm |
Base Copper Thickness | 11um 35um 70um 105um |
Max. aspect ratio(board thickness: hole size) | 8:1 |
V-Cut Angle Tolerance | ±5° |
V-Cut Board Thickness | 0.4mm -3.2mm(16mil -128mil) |
Min SMT Pitch | 0.3mm(12mil) |
Min. Component mark | 0.15mm(6mil) |
Min. width of annular ring(finished) | 0.15mm(6mil)/side |
Min pad opening | 0.076mm(3mil) |
Min S/M Bridge | ±0.076mm(±3mil) |
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times |
Board for what product | Surface Finish |
Number of Layers | Board Material |
Copper Thickness(um) | Board Thickness(um) |
Solder Mask Color | PCB Dimensions(mm) |
Silk Screen Color | Min Finished Hole Size(mm) |
Milling | Min Clearance(mm) |
Min Track Width(mm) | Other special requirements |
Packaging | Vacuum Packing with desiccant, Professional Export Carton. | ||
Delivery time | Prototype | Mass production (above 30m) | |
2L | Quick turn:24h Usual time:3-4days | 5-10days | |
4L | Quick turn:48 hours; Usual time:5-6days | 8-15days | |
6L | Quick turn:72 hours; Usual time:6-8days | 10-16days | |
8L | Quick turn:72 hours; Usual time:8-10days | 16-18days | |
10L | Quick turn:96 hours; Usual time:12-14days | 18-20days | |
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